Free Course Image Electrical - Fabrication of Silicon

Free online courseElectrical - Fabrication of Silicon

Duration of the online course: 35 hours and 10 minutes

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Build job-ready semiconductor skills with this free online course on silicon fabrication, IC labs and CMOS processes—ideal for electricians seeking a certificate boost.

In this free course, learn about

  • Focus and evolution of IC technology from micro to nano; key drivers of semiconductor progress
  • Silicon crystal properties, defects, and growth: starting wafer material; CZ and FZ rod growth methods
  • IC fab cleanroom basics: contamination sources and RO water systems for ultrapure processing
  • Dopant diffusion theory: limited-source charge density, two-step incorporation, gradient-driven drift
  • Diffusion-related material parameters such as Frenkel defect activation energy in silicon
  • Thermal oxidation of silicon: why SiO2 is central; oxidation kinetics and alternate oxide formation methods
  • Device/process insights: why n-channel devices are used as mass-capacitor drivers; industry pioneers
  • Lithography fundamentals: pattern transfer, relation to photography, mask types, and resist gamma behavior
  • Ion implantation: concept, basic implanter impurity source, range/electronic stopping calculations
  • CMOS process flow elements: isolation oxidation and purpose of the channel-stopper step
  • Thin-film deposition overview: dominance in IC manufacturing; LPCVD; evaporation and sputtering basics
  • CVD process control: key parameter governing growth/deposition in chemical vapor deposition
  • Etching concepts including isotropic etching with lateral undercut (vertical + sideways etch behavior)

Course Description

Step beyond basic electrical work and gain a clear, practical view of how modern electronics are made. This free online course connects electrical fundamentals to the real manufacturing steps that turn ultra-pure silicon into the integrated circuits inside everyday devices. If you want to understand what happens inside a fab, speak the language of technicians and engineers, or broaden your opportunities in electronics and industrial environments, this training gives you that bridge from the macro world to the nano scale.

You will develop a solid mental model of silicon as a material: why crystal structure matters, how high-purity silicon is produced, and what can go wrong when contamination enters the process. The course also helps you understand clean lab thinking and process discipline, reinforcing why particle control, water purity, and careful handling practices are essential to yield and reliability. This knowledge is valuable not only for semiconductor work, but for any role where precision, safety, and controlled processes define success.

From there, you will follow how electrical properties are engineered through diffusion and ion implantation, learning how impurities are introduced and driven into silicon to create functional regions in devices. You will also see why silicon dioxide is so central to VLSI technology and how oxidation becomes a key tool for insulation and device formation. As the flow continues, you will understand how patterns are created through lithography, how thin films are added by deposition methods, and how materials are selectively removed by etching to form complete structures. Throughout, the focus is on process understanding and the reasoning behind each step, so you can interpret terminology, troubleshoot intelligently, and connect measurements to outcomes.

Designed within professional skills for electricians and technical learners, the course supports upskilling for roles that intersect with electronics manufacturing, maintenance, QA, or high-tech facilities. By the end, you should feel confident reading process discussions, following a CMOS-oriented fabrication flow at a high level, and explaining how key fabrication choices influence device behavior and reliability.

Course content

  • Video class: Mod-01 Lec-01 Introduction Micro to Nano A Journey into Intergrated Circuit Technology 1h18m
  • Exercise: What is the focus of the course discussed in the transcript?
  • Video class: Mod-01 Lec-02 Introduction Micro to Nano A Journey into Intergrated Circuit Technology 1h09m
  • Exercise: _What are the three driving forces of semiconductor technology?
  • Video class: Mod-01 Lec-03 Crystal Properties and Silico Growth 1h14m
  • Exercise: _What is the starting material for all integrated circuits?
  • Video class: Mod-01 Lec-04 Crystal Properties and Silico Growth contd. 1h17m
  • Exercise: _What are the two standard processes used for growing highly pure Silicon rods?
  • Video class: Mod-01 Lec-05 IC Fab Labs and Fabrication of IC 1h19m
  • Exercise: _What is the major source of particle contamination in an IC Lab?
  • Video class: Mod-01 Lec-06 Diffusion 1h14m
  • Exercise: _What is the purpose of the reverse osmosis system in the VLSI lab?
  • Video class: Mod-01 Lec-07 Diffusion ( cont.) 1h15m
  • Exercise: _What is the activation energy for Frenkel defects in silicon?
  • Video class: Mod-01 Lec-08 Solid State Diffusion 1h16m
  • Exercise: _What is the charge density of impurities in a limited source diffusion process?
  • Video class: Mod-01 Lec-09 Solid State Diffusion ( cont.) 1h24m
  • Exercise: _What is the two-step process for impurity incorporation in solid state diffusion?
  • Video class: Mod-01 Lec-10 Solid State Diffusion ( cont.) 1h17m
  • Exercise: _What is the additional force that can cause impurities to go deeper during higher gradients in diffusion?
  • Video class: Mod-01 Lec-11 Thermal Oxidation of Silicons 50m
  • Exercise: _What is the importance of SiO2 in VLSI technology?
  • Video class: Mod-01 Lec-12 Thermal Oxidation of Silicons 1h19m
  • Exercise: _Which of the following books on VLSI technology is more recent compared to Plummer's book?
  • Video class: Mod-01 Lec-13 Thermal Oxidation of Silicons 1h14m
  • Exercise: _What is the alternate method to growth for creating silicon dioxide?
  • Video class: Mod-01 Lec-14 Thermal Oxidation of Silicons (cont.) 1h17m
  • Exercise: _What is the reason for using n channel devices as drivers in mass capacitors?
  • Video class: Mod-01 Lec-15 Thermal Oxidation of Silicons (cont.) 1h13m
  • Exercise: _Who are the pioneers of mass capacitor business?
  • Video class: Mod-01 Lec-16 Lithography 1h15m
  • Exercise: _What is lithography and how is it related to photography?
  • Video class: Mod-01 Lec-17 Lithography 1h20m
  • Exercise: _What are the two kinds of mask used in lithography?
  • Video class: Mod-01 Lec-18 Lithography 1h32m
  • Exercise: _What is gamma in lithography and how does it vary?
  • Video class: Mod-01 Lec-19 ION Implantation 1h14m
  • Exercise: _What is ion implantation in semiconductor fabrication?
  • Video class: Mod-01 Lec-20 ION Implantation 1h11m
  • Exercise: _What is the formula for calculating the range due to electronic stopping or any range in the direction of ions?
  • Video class: Mod-01 Lec-21 ION Implantation & Silicon IC Processing Flow for CMOS Technology 1h15m
  • Exercise: _What is the source of impurity used in the basic ion implanter?
  • Video class: Mod-01 Lec-22 ION Implantation & Silicon IC Processing Flow for CMOS Technology 1h20m
  • Exercise: _What is the purpose of the channel stopper process step in a normal isolation oxide growth process?
  • Video class: Mod-01 Lec-23 Silicon IC Processing Flow for CMOS Technology 1h11m
  • Exercise: _What is LPCVD?
  • Video class: Mod-01 Lec-24 Thin Film Deposition 1h14m
  • Exercise: _What is the dominant process in all IC manufacture?
  • Video class: Mod-01 Lec-25 Thin Film Deposition 1h02m
  • Exercise: _What is the basic idea behind electron beam evaporation?
  • Video class: Mod-01 Lec-26 Thin Film Deposition 1h10m
  • Exercise: _What is sputtering in the context of electrical fabrication?
  • Video class: Mod-01 Lec-27 Thin Film Deposition & Etching in VLSI Processing 1h20m
  • Exercise: _What is the major important parameter that decides the growth or deposition in chemical vapour deposition processes?
  • Video class: Mod-01 Lec-28 Etching in VLSI Processing & Back - End Technology 1h17m
  • Exercise: _What is the term used to describe the etching process where the etchant not only etches vertically down but also in the lateral side?

This free course includes:

35 hours and 10 minutes of online video course

Digital certificate of course completion (Free)

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Course comments: Electrical - Fabrication of Silicon

AH

anwar haizal

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It really good course for me as chemical engineer to adapt to the semiconductor manufacturing

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